Intel Austria GmbH. – Connected Home Division
Initially our Ressel Center started with project partner Lantiq A GmbH. at 01.04.2014. Lantiq A GmbH. and Intel Mobile Communications Austria GmbH were merged in November 2015 to Intel Austria GmbH. Therefore our project partner is now the “Connected Home Devision” of Intel. Lantiq has a 20+ year record of technology leadership, innovation, and strong customer relationships. Its holistic understanding of broadband technology, complete applications, communication standards, and legacy networks enables the company to offer the broadest portfolio of highly integrated, flexible end-to-end semiconductor solutions for next generation networks and the digital home. Backed by excellent support, Lantiq’s solutions enable global system manufacturers to gain a commercial edge and create high-speed data and communication products which drive innovation in this market and deliver value to carriers and operators. Lantiq’s solutions are deployed by major carriers and found in access networks and home networks in every region of the world. Lantiq’s advanced SoC (system-on-chip) solutions address a wide variety of technologies, including all flavors of xDSL, VoIP, wireless LAN and Gigabit Ethernet, and have allowed Lantiq to become the number one supplier of access network integrated circuits. As a private company, its investor is Golden Gate Capital, a leading private equity firm. Also T-Venture, the venture capital firm of Deutsche Telekom, made a strategic investment in Lantiq. The company is an international fabless semiconductor organization of approximately 800 people. Approximately 70% of Lantiq’s staff consists of R&D engineers. A significant part of Lantiq’s R&D and most of the central functions and executive management are located in Neubiberg (Munich), Germany. The Main R&D locations are in: Europe – Munich, Villach, Riga, Yakum, Asia Pacific – Hsinchu, Singapore and Bangalore.
Intel Austria GmbH. – Communication & Devices Group
Intel Mobile Communications as our “second” partner is now part of Intel’s Communication & Devices Group. It develops, manufactures and markets end-to-end, leading-edge semiconductor products and solutions for wireless communications. IMC’s goal is to enable the smooth transmission of voice and high-speed data to the end-user’s equipment. IMC offers a mature portfolio of RF transceivers, cellular platforms, and connectivity solutions for mobile phones, smartphones, and mobile computing devices. Leveraging its unique advantages in the areas of RF and mixed-signal expertise, monolithic integration capabilities, and excellent knowhow in cellular software and systems, IMC provides superior customer solutions. Intel Mobile Communications Austria GmbH is located in Villach in the south of Austria. Founded in 2011, nearly 40 employees work on CMOS Circuit Development and IT R&D Application and System Architecture. As a part of the Intel Mobile Communications Group, we contribute with our strong RF and Mixed Signal Expertise to signal processing solutions for LTE, UMTS, GSM, WIFI, BT standards. We provide the complete set of expertise including System Engineering, Circuit Design, Physical Design and Component Verification for MCGs wireless product portfolio. A well-developed and innovative lab area ensures the verification of ADCs and DACs for cellular applications.